FOR IMMEDIATE RELEASE
MICRONETICS RECEIVES ORDER FOR INTEGRATED ASSEMBLIES FOR MILITARY RADAR
David Robbins, Senior Vice President of Micronetics' Components and Subassemblies Group, stated, "This order is a result of our strategy of focusing on key customers and developing custom solutions based on "broadband platforms" that have been developed in the past. We are attempting to reduce the need to continually develop "bleeding edge" solutions, but are designing custom solutions from "broadband platforms" that allow for faster design time and are less expensive to our customers than completely new design solutions. By using these "broadband platforms," the risk of technical failure is reduced, the likelihood of cost overruns is lessened and delivery delays are much less likely. We have received significant customer support for this design approach."
Headquartered in Hudson, NH, Micronetics manufactures innovative test equipment and test components that are used to test the strength, durability and integrity of communication signals in communications and Internet infrastructure equipment. Micronetics also manufactures microwave and radio frequency (RF) components and integrated subassemblies used in a variety of defense-related or commercial wireless products. Micronetics serves a diverse customer base, including some of the world's leading technology companies, such as Adtran, Alcatel, BAE Systems, Boeing, ComDev, Datron, EADS, Ericsson, Harris, L-3 Communications, Linkabit, Lockheed Martin, Lucent Technologies, Motorola, NEC, Nortel, Northrop Grumman, Raytheon, Tektronix, Teradyne, Thales and TRW.
Some of the statements contained in this news release are forward-looking statements. The accuracy of these statements cannot be guaranteed as they are subject to a variety of risks, including but not limited to the success of the products into which the Company's products are integrated, governmental action relating to wireless communications licensing and regulation, internal projections as to the demand for certain types of technological innovation, competitive products and pricing, the success of new product development efforts, the timely release for production and the delivery of products under existing contracts, future economic conditions generally, as well as other factors. The information in this release should be reviewed in conjunction with Micronetics' Annual Report for its fiscal year ended March 31, 2001
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